Xilinx - XCV1600E-7BGG560I

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XCV1600E-7BGG560I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV1600E-7BGG560I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet XCV1600E-7BGG560I Datasheet
In Stock111
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 7776 CLBS, 419904 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.42 ns
Maximum Seated Height: 1.7 mm
No. of Inputs: 404
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 404
Position Of Terminal: Bottom
No. of Terminals: 560
No. of Equivalent Gates: 419904
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B560
Maximum Clock Frequency: 400 MHz
Package Shape: Square
Package Code: LBGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 34992
No. of CLBs: 7776
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA560,33X33,50
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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