Xilinx - XCV200-4FGG456C

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XCV200-4FGG456C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV200-4FGG456C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCV200-4FGG456C Datasheet
In Stock931
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Organization: 1176 CLBS, 236666 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.8 ns
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 456
No. of Equivalent Gates: 236666
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 250 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
No. of CLBs: 1176
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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