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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCV2000E-7FG860I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA860,42X42,40; |
Datasheet | XCV2000E-7FG860I Datasheet |
In Stock | 312 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.71 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 9600 CLBS, 518400 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.42 ns |
Maximum Seated Height: | 2.2 mm |
No. of Inputs: | 660 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 660 |
Position Of Terminal: | Bottom |
No. of Terminals: | 860 |
No. of Equivalent Gates: | 518400 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B860 |
Maximum Clock Frequency: | 400 MHz |
Package Shape: | Square |
Package Code: | BGA |
Width: | 42.5 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.89 V |
Nominal Supply Voltage (V): | 1.8 |
Technology Used: | CMOS |
No. of Logic Cells: | 43200 |
No. of CLBs: | 9600 |
JESD-609 Code: | e0 |
Qualification: | No |
Package Equivalence Code: | BGA860,42X42,40 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Length: | 42.5 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.2/3.6,1.8 V |