Xilinx - XCV2000E-7FG860I

XCV2000E-7FG860I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV2000E-7FG860I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA860,42X42,40;
Datasheet XCV2000E-7FG860I Datasheet
In Stock312
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 9600 CLBS, 518400 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.42 ns
Maximum Seated Height: 2.2 mm
No. of Inputs: 660
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 660
Position Of Terminal: Bottom
No. of Terminals: 860
No. of Equivalent Gates: 518400
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B860
Maximum Clock Frequency: 400 MHz
Package Shape: Square
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 43200
No. of CLBs: 9600
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA860,42X42,40
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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