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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCV300-5BG256C |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XCV300-5BG256C Datasheet |
| In Stock | 1,583 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.375 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 1536 CLBS, 322970 Gates |
| Maximum Combinatorial Delay of a CLB: | 0.5 ns |
| Maximum Seated Height: | 2.55 mm |
| Surface Mount: | Yes |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 256 |
| No. of Equivalent Gates: | 322970 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B256 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | BGA |
| Width: | 27 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Other |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 2.625 V |
| Nominal Supply Voltage (V): | 2.5 |
| Technology Used: | CMOS |
| No. of CLBs: | 1536 |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Qualification: | No |
| Finishing Of Terminal Used: | Tin Lead |
| Length: | 27 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1.27 mm |









