Xilinx - XCV3200E-6CGG1156C

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XCV3200E-6CGG1156C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV3200E-6CGG1156C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCV3200E-6CGG1156C Datasheet
In Stock246
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Ceramic, Metal-Sealed Cofired
Organization: 16224 CLBS, 876096 Gates
Maximum Combinatorial Delay of a CLB: 0.47 ns
Maximum Seated Height: 3.11 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 1156
No. of Equivalent Gates: 876096
Package Style (Meter): Grid Array
JESD-30 Code: S-CBGA-B1156
Maximum Clock Frequency: 357.2 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 35 mm
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of CLBs: 16224
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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