Xilinx - XCV400-6BG560I

XCV400-6BG560I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV400-6BG560I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Equivalence Code: BGA560,33X33,50;
Datasheet XCV400-6BG560I Datasheet
In Stock134
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Organization: 2400 CLBS, 468252 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.6 ns
Maximum Seated Height: 1.7 mm
No. of Inputs: 404
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 404
Position Of Terminal: Bottom
No. of Terminals: 560
No. of Equivalent Gates: 468252
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B560
Maximum Clock Frequency: 333 MHz
Package Shape: Square
Package Code: LBGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
Technology Used: CMOS
No. of Logic Cells: 10800
No. of CLBs: 2400
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA560,33X33,50
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.2/3.6,2.5 V
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