Xilinx - XCV400E-8FGG676C

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XCV400E-8FGG676C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV400E-8FGG676C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCV400E-8FGG676C Datasheet
In Stock463
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 2400 CLBS, 129600 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.4 ns
Maximum Seated Height: 2.6 mm
No. of Inputs: 404
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 404
Position Of Terminal: Bottom
No. of Terminals: 676
No. of Equivalent Gates: 129600
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 416 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 10800
No. of CLBs: 2400
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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