Xilinx - XCV50E-8CSG144I

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XCV50E-8CSG144I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV50E-8CSG144I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Length: 12 mm;
Datasheet XCV50E-8CSG144I Datasheet
In Stock379
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 384 CLBS, 20736 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.4 ns
Maximum Seated Height: 1.2 mm
No. of Inputs: 94
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 94
Position Of Terminal: Bottom
No. of Terminals: 144
No. of Equivalent Gates: 20736
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 416 MHz
Package Shape: Square
Package Code: TFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 1728
No. of CLBs: 384
JESD-609 Code: e1
Qualification: No
Package Equivalence Code: BGA144,13X13,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 12 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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