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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCV600E-8BGG432I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 432; Package Code: LBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V; |
Datasheet | XCV600E-8BGG432I Datasheet |
In Stock | 360 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.71 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 3456 CLBS, 186624 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.4 ns |
Maximum Seated Height: | 1.7 mm |
No. of Inputs: | 316 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 316 |
Position Of Terminal: | Bottom |
No. of Terminals: | 432 |
No. of Equivalent Gates: | 186624 |
Package Style (Meter): | Grid Array, Low Profile |
JESD-30 Code: | S-PBGA-B432 |
Maximum Clock Frequency: | 416 MHz |
Package Shape: | Square |
Package Code: | LBGA |
Width: | 40 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.89 V |
Nominal Supply Voltage (V): | 1.8 |
Technology Used: | CMOS |
No. of Logic Cells: | 15552 |
No. of CLBs: | 3456 |
JESD-609 Code: | e1 |
Qualification: | No |
Package Equivalence Code: | BGA432,31X31,50 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 40 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1.27 mm |
Peak Reflow Temperature (C): | 260 °C (500 °F) |
Power Supplies (V): | 1.2/3.6,1.8 V |