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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCV800-4BG560C |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; |
Datasheet | XCV800-4BG560C Datasheet |
In Stock | 387 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.375 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 4704 CLBS, 888439 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Combinatorial Delay of a CLB: | 0.8 ns |
Maximum Seated Height: | 1.7 mm |
No. of Inputs: | 404 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 404 |
Position Of Terminal: | Bottom |
No. of Terminals: | 560 |
No. of Equivalent Gates: | 888439 |
Package Style (Meter): | Grid Array, Low Profile |
JESD-30 Code: | S-PBGA-B560 |
Maximum Clock Frequency: | 250 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | LBGA |
Width: | 42.5 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | Other |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 2.625 V |
Nominal Supply Voltage (V): | 2.5 |
Technology Used: | CMOS |
No. of Logic Cells: | 21168 |
No. of CLBs: | 4704 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Qualification: | No |
Package Equivalence Code: | BGA560,33X33,50 |
Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
Length: | 42.5 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1.27 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.2/3.6,2.5 V |