Xilinx - XCV812E-7FGG900C

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XCV812E-7FGG900C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV812E-7FGG900C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCV812E-7FGG900C Datasheet
In Stock244
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 4704 CLBS, 254016 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.42 ns
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 900
No. of Equivalent Gates: 254016
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Maximum Clock Frequency: 400 MHz
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Commercial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of CLBs: 4704
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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