Xilinx - XCVC1702-2MLENSVG1369

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XCVC1702-2MLENSVG1369 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVC1702-2MLENSVG1369
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet XCVC1702-2MLENSVG1369 Datasheet
In Stock478
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Maximum Seated Height: 4 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 1369
Package Equivalence Code: BGA1369,37X37,36
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 35 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B1369
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: HBGA
Width: 35 mm
Terminal Pitch: .92 mm
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