Xilinx - XCVC1902-2MSEVSVA2197

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XCVC1902-2MSEVSVA2197 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVC1902-2MSEVSVA2197
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
Datasheet XCVC1902-2MSEVSVA2197 Datasheet
In Stock350
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Maximum Seated Height: 4 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
No. of Terminals: 2197
Package Equivalence Code: BGA2197,47X47,36
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 45 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B2197
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: HBGA
Width: 45 mm
Terminal Pitch: .92 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
350 $3,660.000 $1,281,000.000

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