Xilinx - XCVE2102-1MSESBVA625

XCVE2102-1MSESBVA625 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVE2102-1MSESBVA625
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;
Datasheet XCVE2102-1MSESBVA625 Datasheet
In Stock450
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 625
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B625
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
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