Xilinx - XCVE2302-2HSISFVA784

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XCVE2302-2HSISFVA784 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVE2302-2HSISFVA784
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet XCVE2302-2HSISFVA784 Datasheet
In Stock52
NAME DESCRIPTION
Minimum Supply Voltage: .854 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .88 V
Maximum Supply Voltage: .906 V
Maximum Seated Height: 3.66 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 784
Package Equivalence Code: BGA784,28X28,31
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B784
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: BGA
Width: 23 mm
Terminal Pitch: .8 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
52 $5,250.473 $273,024.596

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