Image shown is a representation only.
| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCVH1582-1LSELSVA4737 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4737; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel; |
| Datasheet | XCVH1582-1LSELSVA4737 Datasheet |
| In Stock | 1,563 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .676 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | .7 V |
| Maximum Supply Voltage: | .724 V |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 4737 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B4737 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |









