Xilinx - XCVM1102-1LSESFVA784

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XCVM1102-1LSESFVA784 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVM1102-1LSESFVA784
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
Datasheet XCVM1102-1LSESFVA784 Datasheet
In Stock390
NAME DESCRIPTION
Minimum Supply Voltage: .676 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .7 V
Maximum Supply Voltage: .724 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
No. of Terminals: 784
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B784
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
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