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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVM1402-1MSEVFVC1596 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
Datasheet | XCVM1402-1MSEVFVC1596 Datasheet |
In Stock | 351 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .775 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .8 V |
Maximum Supply Voltage: | .825 V |
Maximum Seated Height: | 3.75 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 1596 |
Package Equivalence Code: | BGA1596,40X40,36 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 37.5 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B1596 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Package Code: | BGA |
Width: | 37.5 mm |
Terminal Pitch: | .92 mm |