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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCVM1502-1LSENFVB1369 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .676 V; |
| Datasheet | XCVM1502-1LSENFVB1369 Datasheet |
| In Stock | 258 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .676 V |
| Other Names: | 122-XCVM1502-1LSENFVB1369 |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | .7 V |
| Maximum Supply Voltage: | .724 V |
| Maximum Seated Height: | 3.83 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 1369 |
| Package Equivalence Code: | BGA1369,37X37,36 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 35 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B1369 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |
| Width: | 35 mm |
| Terminal Pitch: | .92 mm |









