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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVM1502-2MLENFVB1369 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.83 mm; |
Datasheet | XCVM1502-2MLENFVB1369 Datasheet |
In Stock | 66 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .775 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .8 V |
Maximum Supply Voltage: | .825 V |
Maximum Seated Height: | 3.83 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 1369 |
Package Equivalence Code: | BGA1369,37X37,36 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Length: | 35 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B1369 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 110 Cel |
Package Code: | BGA |
Width: | 35 mm |
Terminal Pitch: | .92 mm |