Xilinx - XCVM1502-2MLEVSVA2197

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XCVM1502-2MLEVSVA2197 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVM1502-2MLEVSVA2197
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet XCVM1502-2MLEVSVA2197 Datasheet
In Stock205
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .8 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 4 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 2197
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Technology: CMOS
JESD-30 Code: S-PBGA-B2197
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: HBGA
Width: 45 mm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: .825 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA2197,47X47,36
Length: 45 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .92 mm
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