Xilinx - XCVP1402-3HSEVSVD2197

XCVP1402-3HSEVSVD2197 by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XCVP1402-3HSEVSVD2197
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet XCVP1402-3HSEVSVD2197 Datasheet
In Stock419
NAME DESCRIPTION
Minimum Supply Voltage: .854 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .88 V
Maximum Supply Voltage: .906 V
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 2197
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B2197
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
419 - -

Popular Products

Category Top Products