Xilinx - XCVP1702-3HSEVSVA5601

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XCVP1702-3HSEVSVA5601 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVP1702-3HSEVSVA5601
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: BGA; Package Shape: RECTANGULAR; Minimum Supply Voltage: .854 V;
Datasheet XCVP1702-3HSEVSVA5601 Datasheet
In Stock376
NAME DESCRIPTION
Minimum Supply Voltage: .854 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .88 V
Maximum Supply Voltage: .906 V
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 5601
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B5601
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
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