Xilinx - XCVP1802-1MSILSVC4072

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XCVP1802-1MSILSVC4072 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVP1802-1MSILSVC4072
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4072; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B4072;
Datasheet XCVP1802-1MSILSVC4072 Datasheet
In Stock1,525
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Maximum Seated Height: 4.56 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 4072
Package Equivalence Code: BGA4072,64X64,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 65 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B4072
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: HBGA
Width: 65 mm
Terminal Pitch: 1 mm
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