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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCVP1802-3HSELSVC4072 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4072; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA4072,64X64,40; |
| Datasheet | XCVP1802-3HSELSVC4072 Datasheet |
| In Stock | 239 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .854 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | .88 V |
| Maximum Supply Voltage: | .906 V |
| Maximum Seated Height: | 4.56 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 4072 |
| Package Equivalence Code: | BGA4072,64X64,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 65 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B4072 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | HBGA |
| Width: | 65 mm |
| Terminal Pitch: | 1 mm |
