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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVU095-L1FFVB1760I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Organization: 768 CLBS; |
Datasheet | XCVU095-L1FFVB1760I Datasheet |
In Stock | 84 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .873 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 768 CLBS |
Programmable IC Type: | FPGA |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Supply Voltage: | .927 V |
Maximum Seated Height: | 3.81 mm |
Nominal Supply Voltage (V): | .9 |
No. of CLBs: | 768 |
Surface Mount: | Yes |
JESD-609 Code: | e1 |
Position Of Terminal: | Bottom |
No. of Terminals: | 1760 |
Finishing Of Terminal Used: | Tin Silver Copper |
Package Style (Meter): | Grid Array |
Length: | 42.5 mm |
JESD-30 Code: | S-PBGA-B1760 |
Form Of Terminal: | Ball |
Package Shape: | Square |
Pitch Of Terminal: | 1 mm |
Package Code: | BGA |
Peak Reflow Temperature (C): | 245 °C (473 °F) |
Width: | 42.5 mm |
Moisture Sensitivity Level (MSL): | 4 |