Xilinx - XCVU125-H1FLVD1517E

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XCVU125-H1FLVD1517E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVU125-H1FLVD1517E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCVU125-H1FLVD1517E Datasheet
In Stock348
NAME DESCRIPTION
Minimum Supply Voltage: .922 V
Package Body Material: Plastic/Epoxy
Organization: 89520 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 4.09 mm
No. of Inputs: 884
Surface Mount: Yes
No. of Outputs: 884
Position Of Terminal: Bottom
No. of Terminals: 1517
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1517
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 40 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .979 V
Nominal Supply Voltage (V): 0.95
No. of Logic Cells: 1566600
No. of CLBs: 89520
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA1517,39X39,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 40 mm
Form Of Terminal: Ball
Additional Features: Also Operates at 1 V nominal supply
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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