Xilinx - XCVU9P-3FLGA2577E

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XCVU9P-3FLGA2577E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVU9P-3FLGA2577E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCVU9P-3FLGA2577E Datasheet
In Stock328
NAME DESCRIPTION
Minimum Supply Voltage: .873 V
Package Body Material: Plastic/Epoxy
Organization: 147780 CLBS
Maximum Seated Height: 4.24 mm
No. of Inputs: 832
Surface Mount: Yes
No. of Outputs: 832
Position Of Terminal: Bottom
No. of Terminals: 2577
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B2577
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 52.5 mm
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .927 V
Nominal Supply Voltage (V): 0.9
No. of Logic Cells: 2586150
No. of CLBs: 147780
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA2577,51X51,40
Length: 52.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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