XCZU15EG-1FFVC900I4524 by Xilinx | Peripheral ICs

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Manufacturer	Xilinx
Manufacturer's Part Number	XCZU15EG-1FFVC900I4524
Description	MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet	XCZU15EG-1FFVC900I4524 Datasheet
In Stock	427

NAME	DESCRIPTION
Minimum Supply Voltage:	.808 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	.85 V
Maximum Seated Height:	3.42 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	900
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B900
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	100 Cel
Package Code:	BGA
Width:	31 mm
Moisture Sensitivity Level (MSL):	4
Peripheral IC Type:	MICROPROCESSOR CIRCUIT
Maximum Supply Voltage:	.892 V
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Package Equivalence Code:	BGA900,30X30,40
Length:	31 mm
Bus Compatibility:	CAN, I2C, PCI, SPI, UART, USB
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
427	-	-

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