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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCZU1EG-1SFVA625E |
Description | MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30; |
Datasheet | XCZU1EG-1SFVA625E Datasheet |
In Stock | 1,103 |
NAME | DESCRIPTION |
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Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Peak Reflow Temperature (C): | 250 |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
JESD-609 Code: | e1 |
Moisture Sensitivity Level (MSL): | 4 |