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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCZU1EG-2SFVA625E |
| Description | MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); |
| Datasheet | XCZU1EG-2SFVA625E Datasheet |
| In Stock | 534 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 122-XCZU1EG-2SFVA625E |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Peak Reflow Temperature (C): | 250 |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| JESD-609 Code: | e1 |
| Moisture Sensitivity Level (MSL): | 4 |









