Xilinx - XCZU4EV-2SFVC784I

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XCZU4EV-2SFVC784I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU4EV-2SFVC784I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet XCZU4EV-2SFVC784I Datasheet
In Stock3
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: .876 V
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 784
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B784
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): 250
Package Code: BGA
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 4
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