XCZU5EG-1FBVB900I by Xilinx | Peripheral ICs

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Manufacturer	Xilinx
Manufacturer's Part Number	XCZU5EG-1FBVB900I
Description	PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet	XCZU5EG-1FBVB900I Datasheet
In Stock	1,098

NAME	DESCRIPTION
Minimum Supply Voltage:	.825 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	.85 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2.88 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	900
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B900
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	100 Cel
Package Code:	BGA
Width:	31 mm
Moisture Sensitivity Level (MSL):	4
Peripheral IC Type:	PROGRAMMABLE SoC
Maximum Supply Voltage:	.876 V
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Package Equivalence Code:	BGA900,30X30,40
Length:	31 mm
Peak Reflow Temperature (C):	245
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,098	-	-

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