Xilinx - XCZU7EG-2LFBVB900E

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XCZU7EG-2LFBVB900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU7EG-2LFBVB900E
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCZU7EG-2LFBVB900E Datasheet
In Stock354
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Seated Height: 2.88 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
External Data Bus Width: 0
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA900,30X30,40
Length: 31 mm
Bus Compatibility: CAN, I2C, SPI, UART
Terminal Pitch: 1 mm
Temperature Grade: OTHER
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