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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCZU7EV-L2FFVF1517E |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR; |
Datasheet | XCZU7EV-L2FFVF1517E Datasheet |
In Stock | 1,605 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .698 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .72 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Supply Voltage: | .742 V |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 1517 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B1517 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Additional Features: | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
Maximum Operating Temperature: | 110 Cel |
Peak Reflow Temperature (C): | 245 |
Package Code: | BGA |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 4 |