Xilinx - XCZU9EG-1LFFVB1156I

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XCZU9EG-1LFFVB1156I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU9EG-1LFFVB1156I
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu);
Datasheet XCZU9EG-1LFFVB1156I Datasheet
In Stock220
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Organization: 34260 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.42 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA SOC
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 599550
No. of CLBs: 34260
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 3.42 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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