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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCZU9EG-2LFFVB1156E |
Description | FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30; |
Datasheet | XCZU9EG-2LFFVB1156E Datasheet |
In Stock | 425 |
NAME | DESCRIPTION |
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Package Body Material: | Plastic/Epoxy |
Organization: | 34260 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 3.42 mm |
Surface Mount: | Yes |
Position Of Terminal: | Bottom |
No. of Terminals: | 1156 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B1156 |
Package Shape: | Square |
Maximum Operating Temperature: | 110 °C (230 °F) |
Package Code: | BGA |
Width: | 35 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA SOC |
Nominal Supply Voltage (V): | 0.85 |
No. of Logic Cells: | 599550 |
No. of CLBs: | 34260 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Finishing Of Terminal Used: | Tin/Silver/Copper |
Length: | 3.42 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 245 °C (473 °F) |