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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCZU9EG-3FFVB1156I |
Description | FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES; |
Datasheet | XCZU9EG-3FFVB1156I Datasheet |
In Stock | 308 |
NAME | DESCRIPTION |
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Package Body Material: | Plastic/Epoxy |
Organization: | 34260 CLBS |
Programmable IC Type: | FPGA SOC |
Maximum Seated Height: | 3.42 mm |
Nominal Supply Voltage (V): | 0.9 |
No. of Logic Cells: | 599550 |
No. of CLBs: | 34260 |
Surface Mount: | Yes |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Position Of Terminal: | Bottom |
No. of Terminals: | 1156 |
Finishing Of Terminal Used: | Tin Silver Copper |
Package Style (Meter): | Grid Array |
Length: | 3.42 mm |
JESD-30 Code: | S-PBGA-B1156 |
Form Of Terminal: | Ball |
Package Shape: | Square |
Pitch Of Terminal: | 1 mm |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | BGA |
Width: | 35 mm |
Moisture Sensitivity Level (MSL): | 4 |