Xilinx - XCZU9EG-3FFVC900I

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XCZU9EG-3FFVC900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU9EG-3FFVC900I
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;
Datasheet XCZU9EG-3FFVC900I Datasheet
In Stock393
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Organization: 34260 CLBS
Programmable IC Type: FPGA SOC
Maximum Seated Height: 3.42 mm
Nominal Supply Voltage (V): 0.9
No. of Logic Cells: 599550
No. of CLBs: 34260
Surface Mount: Yes
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Position Of Terminal: Bottom
No. of Terminals: 900
Finishing Of Terminal Used: Tin Silver Copper
Package Style (Meter): Grid Array
Length: 3.42 mm
JESD-30 Code: S-PBGA-B900
Form Of Terminal: Ball
Package Shape: Square
Pitch Of Terminal: 1 mm
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
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Pricing (USD)

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