Xilinx - XQ4013XL-3BGG256N

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XQ4013XL-3BGG256N by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ4013XL-3BGG256N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ4013XL-3BGG256N Datasheet
In Stock852
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Organization: 576 CLBS, 10000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.6 ns
Maximum Seated Height: 2.55 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 256
No. of Equivalent Gates: 10000
Package Style (Meter): Grid Array
Screening Level: MIL-PRF-38535
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 166 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
No. of CLBs: 576
JESD-609 Code: e1
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Typical gates = 10000 to 30000
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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