Xilinx - XQ5VFX70T-1EF665M

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XQ5VFX70T-1EF665M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ5VFX70T-1EF665M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ5VFX70T-1EF665M Datasheet
In Stock165
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Maximum Combinatorial Delay of a CLB: 0.9 ns
Maximum Seated Height: 2.9 mm
No. of Inputs: 360
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 360
Position Of Terminal: Bottom
No. of Terminals: 665
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B665
Maximum Clock Frequency: 1098 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 27 mm
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 71680
No. of CLBs: 6080
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Package Equivalence Code: BGA665,26X26,40
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Power Supplies (V): 1,2.5 V
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