Xilinx - XQ6VLX130T-1LRF1156M

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XQ6VLX130T-1LRF1156M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ6VLX130T-1LRF1156M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ6VLX130T-1LRF1156M Datasheet
In Stock346
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Organization: 10000 CLBS
Maximum Combinatorial Delay of a CLB: 0.85 ns
Maximum Seated Height: 3.53 mm
No. of Inputs: 600
Surface Mount: Yes
No. of Outputs: 600
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 35 mm
Grading Of Temperature: Military
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 128000
No. of CLBs: 10000
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin Lead
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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