Xilinx - XQ6VSX315T-1LRF1759I

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XQ6VSX315T-1LRF1759I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ6VSX315T-1LRF1759I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ6VSX315T-1LRF1759I Datasheet
In Stock264
NAME DESCRIPTION
Minimum Supply Voltage: .91 V
Package Body Material: Plastic/Epoxy
Organization: 24600 CLBS
Maximum Combinatorial Delay of a CLB: 0.85 ns
Maximum Seated Height: 4.37 mm
No. of Inputs: 720
Surface Mount: Yes
No. of Outputs: 720
Position Of Terminal: Bottom
No. of Terminals: 1759
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1759
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: .97 V
Technology Used: CMOS
No. of Logic Cells: 314880
No. of CLBs: 24600
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA1759,42X42,40
Finishing Of Terminal Used: Tin Lead
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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