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Manufacturer | Xilinx |
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Manufacturer's Part Number | XQ6VSX315T-L1FFG1156I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified; |
Datasheet | XQ6VSX315T-L1FFG1156I Datasheet |
In Stock | 448 |
NAME | DESCRIPTION |
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Package Body Material: | Plastic |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
No. of Inputs: | 600 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 600 |
Position Of Terminal: | Bottom |
No. of Terminals: | 1156 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B1156 |
Maximum Clock Frequency: | 1098 MHz |
Package Shape: | Square |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA |
Nominal Supply Voltage (V): | .9 |
Technology Used: | CMOS |
No. of Logic Cells: | 315000 |
JESD-609 Code: | e1 |
Qualification: | No |
Package Equivalence Code: | BGA1156,34X34,40 |
Finishing Of Terminal Used: | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 245 °C (473 °F) |
Power Supplies (V): | 0.9 V |