Xilinx - XQ6VSX475T-1LRF1759M

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XQ6VSX475T-1LRF1759M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ6VSX475T-1LRF1759M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 1759; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ6VSX475T-1LRF1759M Datasheet
In Stock146
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Organization: 37200 CLBS
Maximum Combinatorial Delay of a CLB: 0.85 ns
Maximum Seated Height: 4.37 mm
No. of Inputs: 840
Surface Mount: Yes
No. of Outputs: 840
Position Of Terminal: Bottom
No. of Terminals: 1759
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1759
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Military
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 476160
No. of CLBs: 37200
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA1759,42X42,40
Finishing Of Terminal Used: Tin Lead
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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