Xilinx - XQ6VSX475T-2RFG1156I

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XQ6VSX475T-2RFG1156I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ6VSX475T-2RFG1156I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ6VSX475T-2RFG1156I Datasheet
In Stock75
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 37200 CLBS
Maximum Combinatorial Delay of a CLB: 0.67 ns
Maximum Seated Height: 3.53 mm
No. of Inputs: 600
Surface Mount: Yes
No. of Outputs: 600
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 476160
No. of CLBs: 37200
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin Lead
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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