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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XQ6VSX475T-L1FFG1156I |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 476000; |
| Datasheet | XQ6VSX475T-L1FFG1156I Datasheet |
| In Stock | 564 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Plastic |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| No. of Inputs: | 600 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 600 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 1156 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B1156 |
| Maximum Clock Frequency: | 1098 MHz |
| Package Shape: | Square |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 4 |
| Programmable IC Type: | FPGA |
| Nominal Supply Voltage (V): | .9 |
| Technology Used: | CMOS |
| No. of Logic Cells: | 476000 |
| JESD-609 Code: | e1 |
| Qualification: | No |
| Package Equivalence Code: | BGA1156,34X34,40 |
| Finishing Of Terminal Used: | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 245 °C (473 °F) |
| Power Supplies (V): | 0.9 V |








