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Manufacturer | Xilinx |
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Manufacturer's Part Number | XQ7Z020-L1CL400I |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | XQ7Z020-L1CL400I Datasheet |
In Stock | 385 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.6 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Lead (Sn/Pb) |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 400 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Length: | 17 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B400 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Package Code: | LFBGA |
Width: | 17 mm |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |