Xilinx - XQ7Z020-L1CL400I

XQ7Z020-L1CL400I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7Z020-L1CL400I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XQ7Z020-L1CL400I Datasheet
In Stock385
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Terminals: 400
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 17 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: LFBGA
Width: 17 mm
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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