Xilinx - XQ7Z030-1RF900I

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XQ7Z030-1RF900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7Z030-1RF900I
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
Datasheet XQ7Z030-1RF900I Datasheet
In Stock1,040
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Ultraviolet Erasable: N
Maximum Seated Height: 3.44 mm
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Terminal Finish: TIN LEAD
JESD-609 Code: e0
No. of Terminals: 900
Qualification: Not Qualified
Package Equivalence Code: BGA900,30X30,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 31 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 31 mm
Terminal Pitch: 1 mm
Power Supplies (V): 1,1.8
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