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Manufacturer | Xilinx |
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Manufacturer's Part Number | XQ7Z030-1RF900Q |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | XQ7Z030-1RF900Q Datasheet |
In Stock | 454 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Ultraviolet Erasable: | N |
Maximum Seated Height: | 3.44 mm |
Sub-Category: | Other uPs/uCs/Peripheral ICs |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 900 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B900 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | BGA |
Width: | 31 mm |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA900,30X30,40 |
Length: | 31 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 1,1.8 |